VLO HP Vacuum Soldering Systems

VLO series has been extended by an overpressure process systems

Centrotherm developers have extended the VLO product family. With VLO HP centrotherm meets the market requirements and enables soldering with overpressure.The new VLO product member is based on the proven “modular VLO-assembly”, which offers highest flexibility. This feature allows the installation of various process gases in order to use the system for several applications.Gauge pressure within the process chamber can individually be adjusted to maximum 3 bar. This option has positive effects to void reduction during the soldering. Furthermore, the overpressure is useful for hermetic gas-sealing within the component. To ensure that overpressure is kept accurately, a special controller monitors and verifies the pressure in the chamber. For customers from MEMS, Power Semiconductor, Advanced Packaging, Defence as well as Optoelectronics, this attribute is very interesting. Basically, the system can be used for many other applications and products.The basic model is equipped with one nitrogen gas line. Other inert gas lines are possible as well. Depending on customer application and soldering material, two additional gas lines can be added. The products of the VLO family have the possibility to run processes with the following gases: N2/H2•(95/5%), HCOOH (with bubbler), 100%H2. The safety technique has been especially expanded for the VLO HP, to be prepared for propane gas processes. Depending on applied gas lines the VLO systems offer special safety equipment to assure a safe condition for man and machine. Software and recipe-creation is characterized by the well-known comfort of a Touch Panel PC. Any process parameters (temperature, pressure, gas flow etc.) can be evaluated for traceability. Except the overpressure option for VLO HP, the software interface is identical within the whole VLO product range.The proven heating and cooling system of the VLO product family is used for the VLO HP as well. With this concept, VLO HP achieves heating rates

Applications

•Power Semiconductors

•Advanced packaging

•Hybrid Microelectronic Assemblies

•Optoelectronic Packaging 

•Hermetic Package Sealing 

•Wafer Level Packaging

•UHB LED Packaging 

•MEMS Package Sealing

Benefits

•Vacuum and high pressure system integration

•Process temperature up to 450 °C 

•Excellent temperature uniformity 

•Heating rate up to 50k/min

•Cooling rate up to 160k/min

•PLC safety system

•Maximum flexibility based on proven modular VLO assembly

•Key data:

Application: R&D & small batch production

Heating plate size: 430 x 252 mm2 [16.9 in. x 9.9 in.]

Number of heating plates: 1 heating plate

Maximum substrate height: 110 - 183 mm [4.3 - 7.2 in.]

Load capacity of each heating plate: 7.5kg [16.5lbs.]

Usable process gas: H2 up to 100%; N2/H2 95/5 % 

Power: 400 V / 30 A; 13 kWp

Cooling water: 15 l/min [3.96 G/min] @ 15 - 25 °C

Heating/cooling rate: Max 50 K/min | Max 160 K/min [nitrogen overpressure environment] 

Vacuum: Maximum 10-1 mbar [7.5 x 10-2 torr]

Overpressure: maximum 3 bar

Process temperature up to 450 °C

Weight: ~440 kg [970 lbs.] 

* The system can be modified according to the power supply in different countries

Options:

Propane gas, extended safety technology 

100% H2 unit, safety level 2

6 sets of thermocouples for surface temperature monitoring

95 L chamber capacity 

Substrate height up to 183mm [7.2 in.]