VLO180/VLO300 Vacuum Soldering Systems

Vacuum Soldering System for high volume production

The centrotherm VLO 180 or VLO 300 vacuum soldering systems are ideally suited for high volume production facilities with various materials up to 750 °C. 

The integrated heating and cooling plates can be individually controlled. With VLO 180 or VLO 300 , the soldered area affected by voids can be reduced to less than 2% while typical reflow soldering systems range at 20%.

The system is ideally suited for production facilities which run fluxless and voidless soldering processes with various gas atmospheres [N2, H2 100, N2/H2 95/5]. Chemical activation with HCOOH for ultra clean soldering joints is optionally available. Even lead free paste or pre-forms can be used without additional flux.

The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. Accessibility through Ethernet and USB interfaces allows connection with printers, external storage devices and remote access.

Applications：

•Power Semiconductors 

•Optoelectronic Packaging 

•Hermetic Package Sealing 

•Wafer Level Packaging

•UHB LED Packaging

•MEMS Package Sealing

Benefits：

•Process temperature up to 650 °C

•Excellent temperature uniformity 

•Heating rate up to 40k/min 

•Cooling rate up to 180k/min

•Vacuum level up to10-1 mbar

•High productivity

•Large processing area: VLO180:0.66m2 (1 in.2), VLO 300:1.1m2 (1.7 in.2)